ConnectUs Technologies announces interoperability between its Wi-Fi Cloud Modular Application Platform (CMAP) and a variety of Access Points from several vendors running TIP’s Open AP software. A demonstration originally planned at Mobile World Congress 2020 at the Telecom Infra Project (TIP) booth will be rescheduled for a future event.
ConnectUs CMAP provides individually deployable cloud modules for centralized management, customer profiles, quality of experience management, network automation and network troubleshooting. Cloud based radio resource management optimizes the Wi-Fi capacity and user experience. Network KPIs and events history allow troubleshooting without truck rolls, and without having to wait to replicate the issues. Using machine learning and rule engines enable network automation.
“Adapting the CMAP platform to work with TIP products will allow Wi-Fi providers to bring unprecedented innovation, quality of experience and cost reductions to enterprises large and small,” said Bernard Herscovici, CEO of ConnectUs Technologies.
The TIP Wi-Fi Project Group is bringing an eco-system centric approach to Wi-Fi, enlisting the collaboration of major service providers, OEMs, software and silicon providers. “We welcome ConnectUs Technologies participation in TIP’s Wi-Fi Project Group, and look forward to our future collaboration,” said Attilio Zani, Executive Director, the Telecom Infra Project.
About ConnectUs Technologies
ConnectUs is leading the transition to a disaggregated Wi-Fi network. ConnectUs Cloud platform allows service providers to integrate WLAN controller and management capabilities into their back office. The platform is compatible with the three key components of the Telecom Infra Project Wi-Fi architecture: CloudSDK, certified open source Access Point software and compatible Access Point hardware. ConnectUs is a contributor and co-manager of the TIP open source CloudSDK and Access Point software.
About Telecom Infra Project
TIP is a collaborative telecom community that is evolving the infrastructure that underpins global connectivity. TIP’s mission is to accelerate the pace of innovation in next generation telecom networks, through the design, build, test and deployment of standards-based, open and disaggregated end-to-end solutions. Over the past four years, TIP has driven substantial innovation across all elements of the network including Access, Transport, Core & Services, while spanning urban through to rural market use cases. To date, it has 13 Community Labs which test, validate and integrate solutions, embarked on field trials in Africa, Latin America, Middle East and Europe. The recently launched TIP Exchange hosts 46 products from 29 member companies. Read more: www.telecominfraproject.com.