The wire bonder equipment market is expected to register a CAGR of over 3% during 2020-2024, as per the latest research report by Technavio. The report offers detailed analysis about the impact of COVID-19 pandemic on the market in optimistic, probable, and pessimistic forecast scenarios.
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Technavio has announced its latest market research report titled Global Wire Bonder Equipment Market 2020-2024 (Graphic: Business Wire)
Request for Technavio’s market report estimates including pre- and post-COVID-19 impact on wire bonder equipment market. Download a Free Sample Report on the impact of COVID-19 pandemic analysis.
Due to the extensive spread of the virus across the globe, the Information Technology Industry is anticipated to have Mixed impact. The wire bonder equipment market will showcase Negative impact during 2020-2024.
Wire Bonder Equipment Market 2020-2024: Segmentation
Wire Bonder Equipment Market is segmented as below:
-
End-user
- OSAT
- IDM
-
Geography
- APAC
- North America
- Europe
- South America
- MEA
-
Product
- Ball-bonders
- Stud-bump Bonders
- Wedge Bonders
APAC region will account for the highest incremental growth during the forecast period due to the significant investments by vendors to revamp their production lines and the presence of hubs for semiconductor device manufacturing.
With the surging growth of COVID-19 pandemic, the Information Technology market is anticipated to have a Direct impact during the forecast period. View market snapshot before purchasing
Rising electronic content in automobiles has been an instrumental factor in influencing the growth of wire bonder equipment market. Other market drivers include increase in number of OSAT vendors. Technavio offers custom research analysis on the crucial pointers to highlight the impact of COVID-19 on the market across the supply chain.
Key Considerations for Market Forecast:
- Impact of lockdowns, supply chain disruptions, demand destruction, and change in customer behavior
- Optimistic, probable and pessimistic scenarios for all markets as the impact of pandemic unfolds
- Pre- as well as post-COVID 19 market estimates
- Quarterly impact analysis and updates on market estimates
Get more insights about the global trends impacting the future of wire bonder equipment market, Request Free Sample @ https://www.technavio.com/talk-to-us?report=IRTNTR43223
Wire Bonder Equipment Market 2020-2024: Vendor Analysis
The market is fragmented, and the degree of fragmentation will accelerate during the forecast period. Key players in the market have been launching several initiatives and introducing innovative products and services to cater to a larger target audience during the pandemic. Major market participants include ASM Pacific Technology Ltd., DIAS Automation (HK) Ltd., F & S BONDTEC Semiconductor GmbH, F & K DELVOTEC Bondtechnik GmbH, Kulicke & Soffa Industries Inc., Micro Point Pro Ltd., Palomar Technologies Inc., SHINKAWA Ltd., TPT Wirebonder GmbH & Co. KG, and West Bond Inc.
Technavio’s custom research reports offer detailed insights on the impact of COVID-19 at an industry level, a regional level, and subsequent supply chain operations. This customized report will also help clients keep up with new product launches in direct & indirect COVID-19 related markets, upcoming vaccines and pipeline analysis, and significant developments in vendor operations and government regulations. Register for a free trial today and gain instant access to 17,000+ market research reports. Technavio’s SUBSCRIPTION platform
Table of Contents:
Executive Summary
- Market Overview
Market Landscape
- Market ecosystem
- Value chain analysis
Market Sizing
- Market definition
- Market segment analysis
- Market size 2019
- Market outlook: Forecast for 2019-2024
Five Forces Analysis
- Five forces summary
- Bargaining power of buyers
- Bargaining power of suppliers
- Threat of new entrants
- Threat of substitutes
- Threat of rivalry
- Market condition
Market Segmentation by Product
- Market segments
- Comparison by Product
- Ball bonders – Market size and forecast 2019-2024
- Stud-bump bonders – Market size and forecast 2019-2024
- Wedge bonders – Market size and forecast 2019-2024
- Market opportunity by Product
Market Segmentation by End-user
- Market segments
- Comparison by End-user
- OSAT – Market size and forecast 2019-2024
- IDM – Market size and forecast 2019-2024
- Market opportunity by End-user
Customer landscape
- Overview
Geographic Landscape
- Geographic segmentation
- Geographic comparison
- APAC – Market size and forecast 2019-2024
- North America – Market size and forecast 2019-2024
- Europe – Market size and forecast 2019-2024
- South America – Market size and forecast 2019-2024
- MEA – Market size and forecast 2019-2024
- Key leading countries
- Market opportunity by geography
- Volume drivers- Demand led growth
- Market challenges
- Market trends
Vendor Landscape
- Overview
- Vendor landscape
- Landscape disruption
Vendor Analysis
- Vendors covered
- Market positioning of vendors
- ASM Pacific Technology Ltd.
- DIAS Automation (HK) Ltd.
- F & S BONDTEC Semiconductor GmbH
- F & K DELVOTEC Bondtechnik GmbH
- Kulicke & Soffa Industries Inc.
- Micro Point Pro Ltd.
- Palomar Technologies Inc.
- SHINKAWA Ltd.
- TPT Wirebonder GmbH & Co. KG
- West Bond Inc.
Appendix
- Scope of the report
- Currency conversion rates for US$
- Research methodology
- List of abbreviations
About Us
Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions. With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.
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