CyberOptics Corporation (Nasdaq: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, today announced that it has received an order valued at approximately $1.2 million for Multi-Reflection Suppression (MRS)-enabled 3D SQ3000 CMM (Coordinate Measurement Machine) systems. The systems will be used for in-line Automated Optical Inspection (AOI) and metrology in printer cartridge component manufacturing processes.
The 3D SQ3000 CMM can identify critical defects and measure critical parameters, providing a superior process control solution to improve yields, quality and operational efficiencies in manufacturing facilities. In addition to AOI and Solder Paste Inspection (SPI), highly accurate coordinate measurements can be attained faster than a traditional CMM – in seconds, not hours. The world’s first high speed, in-line CMM includes an extensive software suite for metrology grade measurement on all critical points.
Systems are expected to ship in the second half of 2019, and the Company anticipates that the majority of the revenue will be recognized in the fourth quarter of 2019.
CyberOptics Corporation (www.cyberoptics.com) is a leading global developer and manufacturer of high-precision 3D sensing technology solutions. CyberOptics’ sensors are used for inspection and metrology in the SMT and semiconductor capital equipment markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the Company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.
Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; the timing of orders and shipments of our products, particularly our 3D MRS-enabled AOI systems; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required to meet customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; rapid changes in technology in the electronics and semiconductor markets; product introductions and pricing by our competitors; the success of our 3D technology initiatives; the market acceptance of our SQ3000 3D CMM system, products for semiconductor wafer level and advanced packaging inspection and metrology and CyberGage360 product; costly and time consuming litigation with third parties related to intellectual property infringement; and other factors set forth in the Company’s filings with the Securities and Exchange Commission.