The Ethernet Alliance, a global consortium dedicated to the continued success and advancement of Ethernet technologies, today revealed outcomes from its latest High Speed Networking (HSN) Plugfest. Conducted the week of April 29, 2019 at the University of New Hampshire InterOperability Laboratory (UNH-IOL) in Durham, N.H., the members-only test event included equipment ranging from 25 Gigabit per second (Gb/s) to 400 Gb/s supplied by 13 companies. With pass rates of greater than 97 percent, the plugfest highlights the key role multivendor interoperability plays in Ethernet’s continued success.
“This latest Ethernet Alliance plugfest was a valuable opportunity for testing of both pre-release and market-ready products and solutions against IEEE standards in a confidential, non-competitive environment. The substantial turnout among member companies and high volume of successful tests speaks to Ethernet’s enduring legacy of continuous improvement,” said Dave Chalupsky, plugfest chair and Board of Directors member, Ethernet Alliance; and network product architect, Intel Corporation. “Ethernet’s hallmark multivendor interoperability makes it ideal for addressing global demand for higher-speed connectivity. Test events like this are the key to unleashing that interoperability, so we’re definitely looking forward to our next HSN Plugfest in October 2019.”
The third in its ongoing series, the Ethernet Alliance HSN Plugfest drew participation from 13 diverse member companies representing all aspects of the Ethernet ecosystem. Addressing the need for enabling emerging technologies, products and solutions spanning speeds of 25 Gigabit Ethernet (GbE) up to 400GbE were tested in various form factors such as OSFP, QSFP, and QSFP-DD. Equipment undergoing testing included both electrical and optical interconnects; new signaling and modulation technologies; switches and NICs; cabling; and test and measurement solutions and methodologies.
HSN Plugfest test results showed consistent improvement over previous events, with Frame Error Rate (FER) tests producing a remarkable 100 percent pass rate, and functional interoperability tests achieving an aggregated 97.5 percent pass rate.
Offering a competitive advantage exclusively for members, Ethernet Alliance plugfests provide a neutral, secure testing environment. Among companies taking part were Amphenol Corporation (NYSE: APH); Anritsu Corporation (TYO: 6754); Arista Networks, Inc. (NYSE: ANET); Credo Semiconductor, Inc.; EXFO, Inc. (NASDAQ: EXFO); Fluke Corporation (NYSE: FTV); HG Genuine Co., Ltd.; Intel Corporation (NASDAQ: INTC); The Siemon Company; Spirent Communications plc (LSE: SPT); Tektronix, Inc.; Teledyne LeCroy, Inc. (NYSE: TDY); and Wilder Technologies, LLC.
The next HSN Plugfest, open exclusively to Ethernet Alliance members, is scheduled for October 2019 at UNH-IOL’s state of the art facility. Companies interested in taking advantage of the benefits these test events provide are encouraged to secure participation through membership in the organization. Additionally, select technologies tested during the plugfest will be on display during the Ethernet Alliance’s live, multivendor demo in booth 134 at the 45th European Conference on Optical Communication (ECOC 2019) in Dublin, Ireland.
The Ethernet Alliance is a global consortium that includes system and component vendors, industry experts, and university and government professionals who are committed to the continued success and expansion of Ethernet technology. The Ethernet Alliance takes Ethernet standards to market by supporting activities that span from incubation of new Ethernet technologies to interoperability demonstrations and education. The organization’s plans for 2019 may be found at http://bit.ly/EAMemberEvents-HSNPlugfest.