Spectra7 Microsystems Inc. (TSX:SEV) (“Spectra7” or the “Company”), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, and Molex, a leader in high-performance interconnects, announced that they will be showcasing 400 Gbps Active Copper Cables (ACCs) at this year’s DesignCon show in the Santa Clara Convention Center in Santa Clara, CA from January 28-30, 2020.
Significant US Hyperscaler deployment of 400 Gbps network equipment will begin in 2020 and according to a recently published report by Dell’Oro Group1, total 400 Gbps shipments are forecast to surpass 15 M switch ports by 2023.
“Spectra7 has created a compelling solution to address the dramatically increasing power and cost of data center interconnects,” said Greg Walz, advanced technical marketing manager, Molex. “We are seeing significant interest from our largest customers for 400 Gbps ACCs with Spectra7 technology and are pleased to be showcasing this product at DesignCon 2020.”
“Molex is a technology and market leader in the hyperscale interconnect market,” said Spectra7 CEO Raouf Halim. “The adoption of our 400 Gbps GaugeChangerTM technology by Molex is a significant milestone in the coming volume deployment of GaugeChangerTM, our data center product line.”
GaugeChangerTM is an innovative and disruptive technology that allows copper to extend much longer lengths without the cost and power penalty of optics. It works equally well at 25 Gbps NRZ and 50 Gbps PAM-4 enabling new connector standards of 100, 200 and 400 Gbps.
Molex recently began shipping its Passive Copper QSFP-DD (Quad Small Form Factor–Double Density) Cable Assemblies in volume production and the same customers are asking for Active Copper versions for longer lengths. The Molex system along with Spectra7’s GaugeChangerTM technology offers up to 12 times less power, while providing significant cost savings over optical solutions for hyperscale customers.
Molex will be showing QSFP-DD Active Cable products with Spectra7’s GaugeChangerTM technology at Booth 631 at DesignCon 2020.
Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including automotive, data communications, consumer electronics, medical, and industrial. For more information, please visit www.molex.com
Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.
About Spectra7 Microsystems Inc.
Spectra7 Microsystems Inc. is a high-performance analog semiconductor company delivering unprecedented bandwidth, speed and resolution to enable disruptive industrial design for leading electronics manufacturers in virtual reality, augmented reality, mixed reality, data centers and other connectivity markets. Spectra7 is based in San Jose, California with design centers in Cork, Ireland, and Little Rock, Arkansas. For more information, please visit www.spectra7.com.
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