Press release

Kulicke & Soffa to Feature Latest Electronics Assembly Equipment at SMTconnect 2019

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Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”,
“K&S” or the “Company”), announced today that it will be exhibiting at
the SMTconnect 2019 trade show in Nuremberg, Germany, from May 7 through
9, 2019.

Kulicke & Soffa’s latest flexible Electronics Assembly (EA) equipment
will debut at the trade show along with other range of assembly and
packaging solutions in Hall 4A, Booth #440. Apart from delivering high
accuracy, maximum versatility with maximized feeding space, the new EA
equipment has an improved and unique SlimFit Feeding system, which
improves the handling, uptime and reduces change over significantly. The
system supports industry 4.0 applications, via the IoT Box for
performance monitoring as well as material management and traceability.
Along with the equipment is a facial recognition system which offer fast
and touchless high-speed authentication access to the system.

Other recently introduced K&S’s solution such as the RAPID™ Pro
GEN-S series ball bonder, Asterion™ hybrid wedge
bonder, consumable materials and tools will also be showcased. In
addition, the iFlex T2 equipment will be featured as part of the
IPC CFX showcase with real-time demonstrations at K&S’s booth.

Joeri Durinckx, Kulicke & Soffa’s Senior Director for EA/APMR Business
Unit, said, “With the emerging needs of cybersecurity in the smart
manufacturing environment, the use of advanced sensor technology, such
as facial recognition, will reduce human dependency enhancing factory
security and efficiency.”

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor
packaging and electronic assembly solutions supporting the global
automotive, consumer, communications, computing and industrial segments.
As a pioneer in the semiconductor space, K&S has provided customers with
market leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, electronics assembly,
wedge bonding and a broader range of expendable tools to its core
offerings. Combined with its extensive expertise in process technology
and focus on development, K&S is well positioned to help customers meet
the challenges of packaging and assembling the next-generation of
electronic devices. (www.kns.com)